Intelligent Edge Polishing system
Overview
The Intelligent Edge Polishing system is that polishes the edge of difficult-to-cut compound semiconductors with high efficiency, and contributes to the improvement of the customer’s yield.
Features
- Polishing head position control by edge shape measurement (Option) in advance
→ Reduction of incorrect setting by operators
→ Improved polishing efficiency and Polishing quality improvement
- Compact polishing head (patent)
- Polishing mode :
– Fixed point mode (
)
– Continuous mode (
) - Special polishing tape
Typical specifications
- Wafer type : Compound semiconductor
- Wafer size : Up to 8 inch
- Polishing tape : #2,000 – #10,000
- Utilities : 3-phase 200VAC, 15A (power supply), >= 0.5MPa (compressed air), >= 0.3MPa 5L/min (city water)
Example
| Before Polishing | After Polishing | |
|---|---|---|
| Edge Surface |  |
 |
| Edge Shape |  |
 |
Almost no change in the wafer edge shape
*Edge Surface : The smaller the number of white dots, the better the surface roughness.